![]() The ULTRA X6000 platform has a materials processing envelope of 36 x 24 in (914 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).Ĭonfigure the customizable ULTRA X6000 platform with up to three laser sources consisting of two interchangeable CO2 lasers and one fiber laser. ![]() ![]() With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. The ULTRA X6000 platform offers laser material processing for the widest possible range of materials.
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